![]() This article briefly discusses Fills and Solid Regions, and then explains how Polygon Pours (also called copper pours) are used to create regions of copper on a PCB. In Altium Designer areas of copper can be defined using three different design objects: Fills, Solid Regions and Polygon Pours. The advantage of a Polygon Pour is that it automatically pour around copper objects that belong to another net, in accordance with the applicable Electrical Clearance and Polygon Connect Style Design Rules. It could be a hatched region of grounding copper on an analog design a large, solid region of copper for carrying heavy power supply currents or a solid ground area for EMC shielding. A common requirement on a printed circuit board is large areas of copper.
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